BrainScaleS project

The BrainScaleS project aims to understand information processing in the brain at different scales ranging from individual neurons to whole functional brain areas. The research involves three approaches: in vivo biological experimentation, simulation on petascale supercomputers, and the construction of neuromorphic hardware. The goal is to extract generic theoretical principles of brain function and to use this knowledge to build artificial cognitive systems.

The neuromorphic hardware is based around wafer-scale analog VLSI. Each 20-cm-diameter silicon wafer contains 384 chips, each of which implements 128,000 synapses and up to 512 spiking neurons. This gives a total of ~49 million synapses and ~200,000 neurons per wafer. These VLSI models operate considerably faster than the biological originals, allowing the simulated neural networks to evolve thousands to hundreds-of-thousands quicker than real time.

The project is a European consortium of 13 research groups lead by a team at Heidelberg University, Germany. The project started on January 1, 2011 and has funding from the European Union through until 2014.

Contents

Neuromorphic hardware

The BrainScaleS hardware is based around wafer-scale integration of neuromorphic chips. The silicon wafers are 20 cm in diameter and contain an array of identical, tightly-connected chips. The circuitry is mixed-signal. That is, it contains a mix of both analog and digital circuits. The simulated neurons themselves are analog, while the synaptic weights and interchip communication is digital.

One wafer is built to contain 48 reticles. Each reticle contains 8 HICANN (High Input Count Analog Neural Network) chips. This makes a total of 384 identical chips per wafer.

An HICANN chip is 5x10 mm2 in size. Each one contains an ANC (Analog Neural Core), which is the central functional block, plus supporting circuitry. Each HICANN implements 128,000 synapses and 512 membrane circuits. These can be grouped together to form simulated neurons.

The number of neurons per chip depends on how many synapses are configured per neuron. For the maximum of 16,000 pre-synaptic inputs per neuron, 8 neurons are possible per chip. For the maximum of 512 neurons per chip, there can only be 256 synapses per neuron.

Thus, per wafer there is a total of 49,152,000 synapses, or up to 196,608 neurons. This is assuming that every chip on the wafer is flawless and functional, which will not necessarily always be the case.

The wafer is supported on an aluminum plate which also serves as a heat sink. A multi-layer printed circuit board (PCB) is placed on top of the wafer and this serves as the input/output interface to the neural circuitry. Larger systems can be built by interconnecting several wafer modules.

The circuitry implements time-continuous leaky integrate-and-fire neurons with conductance-based synapses. Neural networks can be created with both short-term and long-term plasticity mechanism. Because of the timescales involved in the chip operation, the neural networks can be evolved thousands of times faster than their real time biological counterparts. Altogether, the BrainScaleS architecture shows promise for studying Hebbian learning, STDP, and cortical dynamics.

The neuromorphic hardware was designed at the universities in Heidelberg and Dresden. The fabrication was done by UMC in Taiwan.

Supercomputer simulations

Coming soon...

In vivo experiments

Coming soon...

Funding

8.5 million euro funding, 1.Jan.2011 to 2014
BrainScaleS is an EU FET-Proactive FP7 funded research project.

BrainScaleS is funded with 9.2 million Euro
(8.5 million from the initial project, 0.7 million from the extension)
for 4 years in the Future Emerging Technologies (FET) programme
as part of EU Seventh Framework Programme (FP7)

Project Start: January 1st, 2011
Project Number 269921
Project extension by project number 287701 end 2011

http://cordis.europa.eu/fetch?RCN=97165
Total cost: 11.18 million euro
EU contribution: 8.5 million euro

Current status

Coming soon...

Timeline

25.Aug.2011 - neural net wafers arrived from UMC fab (BrainScaleS Tweet)
13.Sep.2011 - first wafer test, with wafer probe and needle card, good results (BrainScaleS Tweet)
14.Sep.2011 - first spikes seen (BrainScaleS Tweet)
23.Nov.2011 - first wafer maps available, to be used in network mapping algorithms (BrainScaleS Tweet)

Collaborators

Heidelberg University is leading the research project.
The neuromorphic hardware is being built in Heidelberg and Dresden.
The other universities involved are as follows:

People involved

Project coordinator: Karlheinz Meier  Homepage

Alexander Kononov  Homepage
Heidelberg
 Bernhard Kaplan  Facebook profile Google profile Homepage
KTH Stockholm
 Bernhard Vogginger  Twitter profile
Heidelberg
Björn Kindler  Homepage
Heidelberg, project admin
 Dan Husmann  Homepage
Heidelberg
 Daniel Brüderle  Homepage
Heidelberg, postdoc researcher
Eric Müller  Homepage
Heidelberg
 Holger Zoglauer 
Heidelberg
 Johannes Schemmel  LinkedIn profile Twitter profile Homepage
Heidelberg
Karlheinz Meier  Homepage
Heidelberg, project coordinator
 Marc-Olivier Schwarz  Facebook profile LinkedIn profile Google profile Twitter profile Homepage
PhD candidate
 Mihai Petrovici  Homepage
Heidelberg
Ranjeet Kuruvilla 
Heidelberg
 Sebastian Jeltsch  Homepage
Heidelberg
 Thomas Pfeil  Google profile Homepage
Heidelberg
Venelin Petkov  Google profile
Heidelberg